Integrated circuits are fabricated with lithography techniques to layout the circuitry on semiconductor
substrates. The first step is cleaning, washing, and grinding the
semiconductor substrate to prepare it for exposure to
the patterning equipment. This sweeping exposure can be achieved by laser or water-based resist or chemicals which act as etchants. The developed wafer is then etched chemically, ionically, thermally, or photoelectrically. At this point in time, these methods are accomplished using chemical vapors that deposit desired matter on either a wetted substrate used as an etchant’s mask (which is removed after use)
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